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830-Point Breadboard
This 6.5" x 2.125" solderless breadboard has four bus lines each spanning the length of the board, and 63 rows of pins, enough for up to nine 14-pin DIP ICs or seven 16-pin DIP ICs. The rows and columns of tie points are conveniently labeled, and multiple units can be connected for larger projects. The board features an adhesive backing.
Alternatives available with variations in these parameter(s):
point count
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830-point solderless breadboard. |
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